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The global market for System in Package (Sip) technology is expected to increase from USD 14.89 billion in 2022 to USD 16.34 billion by 2030, representing a CAGR of 11.7% between the years 2023 and 2030.
With more people using smartphones and other smart devices, the market is expected to expand. With the introduction of 5G network-capable devices, the need for system in package technologies has also grown. The price of traditional IC packaging, which comprises packaging with a variety of IC sizes, is expected to climb, which should be good news for the industry as a whole because of the rising need for high-performance electronic devices and the development of sophisticated and tiny consumer electronics. While the system in package (Sip) technology market is expected to increase during the forecast period, it may face obstacles due to a lack of available resources and skilled workers. However, the high cost of Sip and the rise in integration that causes thermal concerns are expected to restrain the market's expansion. New prospects for the system in package (Sip) technology market are anticipated to emerge as internet connectivity spreads to more compact electronic gadgets. Sip technology allows for the highest density of components to be packed into a single box.
User-Centered Analysis
The global market for automotive electronics is segmented into the following end-user industries: aerospace & defense; consumer electronics; telecommunications; and others. Demand for miniaturized electronics is rising as new end-user technologies, such as 5G modules in smartphones, improved electronics in cars, and digital cockpits, make cellphones essential for people in both developed and developing countries. Smart wearables are also an integral part of human health monitoring systems. Because of this change in consumer behavior, the need for portable electronics continues to rise.
Method of Packaging Analysis
Fan-Out Wafer Level Packaging, Wire Bond and Die Attach, and Flip Chip are the three main subsegments of the market based on the packaging method. The worldwide market was primarily driven by Fan-Out Wafer Level Packaging (FOWLP). Intel was one of the first companies to use flip chip packaging to improve the electrical and thermal performance of its base CPUs. In the realm of electronics, FOWLP is a common packaging approach for heterogeneous components like baseband CPUs, RF transceivers, and power management ICs. Increased functionality and reduced package sizes (PMICS) have pushed flip chip packaging technology into widespread use in mobile platforms' baseband and application processors. As the requirement for semiconductor devices with multiple 1/O points rises, it is also expected that demand for the FOWLP packaging approach would rise.
Drivers
The need to shrink the size of electronics is growing.
To maximize usable space and enhance the overall product design, electronic device developers are increasingly turning to components with a small form factor. Customers choose handheld electronic devices that are both compact and feature-rich. To better serve their customers, tech firms are developing increasingly compact electronic devices that pack as many features as possible into a single enclosure. More functionality is provided to customers when as many parts as feasible, including sensors, CPUs, and others, are integrated into a single box.
Restraints
Required Initiating Capital Contribution
A sizable sum of money is needed to get production and printing facilities up and running. Investment is required for the building of factories and the purchase of printing equipment. For example, a rotogravure press costs around $1 million more than a lithographic press. A single rotogravure cylinder can set you back around US$5,000, which is considerably more than the price of a single lithographic plate. However, lithographic printing is being replaced by technologies essential to meet the needs of businesses in a highly competitive market. Offset printing requires expensive equipment and laborious setup procedures.
Trends That Will Shape the Future of the Market
The rising sensitivity of fossil fuels and the expansion of government programs aiming at a cleaner environment bode well for the automobile sector, especially electric vehicles, throughout the projection period. Manufacturers are under pressure to develop a wide range of ICs that meet the stringent safety requirements, short development cycles, and low production costs required by the smart car industry. Image sensors, environmental sensors, and controllers, among others, are in high demand, and integrated packaging technologies have helped meet this demand. In the next five years, wireless networks will experience significant congestion due to the availability of high bandwidth technology. Thus, the transition from the current 3G and 4G LTE technology to 5G would occur more rapidly. It is expected that the aggregate data rates offered by 5G technology will be much quicker than those offered by the current 3G and 4G technologies. Design challenges arise for high-bandwidth RF components like front-end modules (FEM), power amplifier modules (PAM), antenna switch modules (ASM), radio frequency identification (RFID) Sip modules, and local interconnect network (LIN) transceiver Sip modules. As a result, this would open the door for producers of Sip-based RF components to take part in creating state-of-the-art 5G networks.
Report Coverage
Global System in Package (Sip) Technology research report categorizes the market for global based on various segments and regions, forecasts revenue growth, and analyzes trends in each submarket. Global System in Package (Sip) Technology report analyses the key growth drivers, opportunities, and challenges influencing the global market. Recent market developments and System in Package (Sip) Technology competitive strategies such as expansion, product launch and development, partnership, merger, and acquisition have been included to draw the competitive landscape in the market. The report strategically identifies and profiles the key System in Package (Sip) Technology market players and analyses their core competencies in each global market sub-segments.
Key Points Covered in the Report
Competitive Environment:
The research provides an accurate study of the major organisations and companies operating in the global System in Package (Sip) Technology market, along with a comparative evaluation based on their product portfolios, corporate summaries, geographic reach, business plans, System in Package (Sip) Technology market shares in specific segments, and SWOT analyses. A detailed analysis of the firms' recent news and developments, such as product development, inventions, joint ventures, partnerships, mergers and acquisitions, strategic alliances, and other activities, is also included in the study. This makes it possible to assess the level of market competition as a whole.
List of Major Market Participants
ASE Technology Holding Co., Ltd., Amkor Technology, Inc., Siliconware Precision Industries Co., Ltd., Powertech Technology Inc., Taiwan Semiconductor Manufacturing Company Limited, STATS ChipPAC Pte. Ltd., ChipMOS Technologies Inc., Jiangsu Changjiang Electronics Technology Co., Ltd., Intel Corporation, Samsung Electronics Co., Ltd., Fujitsu Limited, Texas Instruments Incorporated, Infineon Technologies AG, Toshiba Corporation, STMicroelectronics N.V., Broadcom Inc., Microchip Technology Inc., NXP Semiconductors N.V., Qualcomm Technologies, Inc., Analog Devices, Inc.
Primary Target Market
Market Segment:
This study forecasts global, regional, and country revenue from 2019 to 2030. INFINITIVE DATA EXPERT has segmented the global System in Package (Sip) Technology market based on the below-mentioned segments:
Global System in Package (Sip) Technology Market, By Packaging Method
Wire Bond
Flip Chip
Fan-Out Wafer Leve
Global System in Package (Sip) Technology market, By Device
Power Management Integrated Circuit (PMIC)
Microelectromechanical Systems (MEMS)
RF Front-End, RF Power Amplifier
Application Processor
Baseband Processor
Global System in Package (Sip) Technology Market, By End User
Consumer Electronics
Automotive
Telecommunication
Industrial System
Aerospace and Defense
Automotive and Transportation
Healthcare
Global System in Package (Sip) Technology market, Regional Analysis
With more people using smartphones and other smart devices, the market is expected to expand. With the introduction of 5G network-capable devices, the need for system in package technologies has also grown. The price of traditional IC packaging, which comprises packaging with a variety of IC sizes, is expected to climb, which should be good news for the industry as a whole because of the rising need for high-performance electronic devices and the development of sophisticated and tiny consumer electronics. While the system in package (Sip) technology market is expected to increase during the forecast period, it may face obstacles due to a lack of available resources and skilled workers. However, the high cost of Sip and the rise in integration that causes thermal concerns are expected to restrain the market's expansion. New prospects for the system in package (Sip) technology market are anticipated to emerge as internet connectivity spreads to more compact electronic gadgets. Sip technology allows for the highest density of components to be packed into a single box.
User-Centered Analysis
The global market for automotive electronics is segmented into the following end-user industries: aerospace & defense; consumer electronics; telecommunications; and others. Demand for miniaturized electronics is rising as new end-user technologies, such as 5G modules in smartphones, improved electronics in cars, and digital cockpits, make cellphones essential for people in both developed and developing countries. Smart wearables are also an integral part of human health monitoring systems. Because of this change in consumer behavior, the need for portable electronics continues to rise.
Method of Packaging Analysis
Fan-Out Wafer Level Packaging, Wire Bond and Die Attach, and Flip Chip are the three main subsegments of the market based on the packaging method. The worldwide market was primarily driven by Fan-Out Wafer Level Packaging (FOWLP). Intel was one of the first companies to use flip chip packaging to improve the electrical and thermal performance of its base CPUs. In the realm of electronics, FOWLP is a common packaging approach for heterogeneous components like baseband CPUs, RF transceivers, and power management ICs. Increased functionality and reduced package sizes (PMICS) have pushed flip chip packaging technology into widespread use in mobile platforms' baseband and application processors. As the requirement for semiconductor devices with multiple 1/O points rises, it is also expected that demand for the FOWLP packaging approach would rise.
Drivers
The need to shrink the size of electronics is growing.
To maximize usable space and enhance the overall product design, electronic device developers are increasingly turning to components with a small form factor. Customers choose handheld electronic devices that are both compact and feature-rich. To better serve their customers, tech firms are developing increasingly compact electronic devices that pack as many features as possible into a single enclosure. More functionality is provided to customers when as many parts as feasible, including sensors, CPUs, and others, are integrated into a single box.
Restraints
Required Initiating Capital Contribution
A sizable sum of money is needed to get production and printing facilities up and running. Investment is required for the building of factories and the purchase of printing equipment. For example, a rotogravure press costs around $1 million more than a lithographic press. A single rotogravure cylinder can set you back around US$5,000, which is considerably more than the price of a single lithographic plate. However, lithographic printing is being replaced by technologies essential to meet the needs of businesses in a highly competitive market. Offset printing requires expensive equipment and laborious setup procedures.
Trends That Will Shape the Future of the Market
The rising sensitivity of fossil fuels and the expansion of government programs aiming at a cleaner environment bode well for the automobile sector, especially electric vehicles, throughout the projection period. Manufacturers are under pressure to develop a wide range of ICs that meet the stringent safety requirements, short development cycles, and low production costs required by the smart car industry. Image sensors, environmental sensors, and controllers, among others, are in high demand, and integrated packaging technologies have helped meet this demand. In the next five years, wireless networks will experience significant congestion due to the availability of high bandwidth technology. Thus, the transition from the current 3G and 4G LTE technology to 5G would occur more rapidly. It is expected that the aggregate data rates offered by 5G technology will be much quicker than those offered by the current 3G and 4G technologies. Design challenges arise for high-bandwidth RF components like front-end modules (FEM), power amplifier modules (PAM), antenna switch modules (ASM), radio frequency identification (RFID) Sip modules, and local interconnect network (LIN) transceiver Sip modules. As a result, this would open the door for producers of Sip-based RF components to take part in creating state-of-the-art 5G networks.
Report Coverage
Global System in Package (Sip) Technology research report categorizes the market for global based on various segments and regions, forecasts revenue growth, and analyzes trends in each submarket. Global System in Package (Sip) Technology report analyses the key growth drivers, opportunities, and challenges influencing the global market. Recent market developments and System in Package (Sip) Technology competitive strategies such as expansion, product launch and development, partnership, merger, and acquisition have been included to draw the competitive landscape in the market. The report strategically identifies and profiles the key System in Package (Sip) Technology market players and analyses their core competencies in each global market sub-segments.
| REPORT ATTRIBUTES | DETAILS |
|---|---|
| Study Period | 2017-2030 |
| Base Year | 2022 |
| Forecast Period | 2022-2030 |
| Historical Period | 2017-2021 |
| Unit | Value (USD Billion) |
| Key Companies Profiled | ASE Technology Holding Co., Ltd., Amkor Technology, Inc., Siliconware Precision Industries Co., Ltd., Powertech Technology Inc., Taiwan Semiconductor Manufacturing Company Limited, STATS ChipPAC Pte. Ltd., ChipMOS Technologies Inc., Jiangsu Changjiang Electronics Technology Co., Ltd., Intel Corporation, Samsung Electronics Co., Ltd., Fujitsu Limited, Texas Instruments Incorporated, Infineon Technologies AG, Toshiba Corporation, STMicroelectronics N.V., Broadcom Inc., Microchip Technology Inc., NXP Semiconductors N.V., Qualcomm Technologies, Inc., Analog Devices, Inc. |
| Segments Covered | • By Product |
| Customization Scope | Free report customization (equivalent to up to 3 analyst working days) with purchase. Addition or alteration to country, regional & segment scope |
Key Points Covered in the Report
- Market Revenue of System in Package (Sip) Technology Market from 2021 to 2030.
- Market Forecast for System in Package (Sip) Technology Market from 2021 to 2030.
- Regional Market Share and Revenue from 2021 to 2030.
- Country Market share within region from 2021 to 2030.
- Key Type and Application Revenue and forecast.
- Company Market Share Analysis, System in Package (Sip) Technology competitive scenario, ranking, and detailed company
profiles. - Market driver, restraints, and detailed COVID-19 impact on System in Package (Sip) Technology
Market
Competitive Environment:
The research provides an accurate study of the major organisations and companies operating in the global System in Package (Sip) Technology market, along with a comparative evaluation based on their product portfolios, corporate summaries, geographic reach, business plans, System in Package (Sip) Technology market shares in specific segments, and SWOT analyses. A detailed analysis of the firms' recent news and developments, such as product development, inventions, joint ventures, partnerships, mergers and acquisitions, strategic alliances, and other activities, is also included in the study. This makes it possible to assess the level of market competition as a whole.
List of Major Market Participants
ASE Technology Holding Co., Ltd., Amkor Technology, Inc., Siliconware Precision Industries Co., Ltd., Powertech Technology Inc., Taiwan Semiconductor Manufacturing Company Limited, STATS ChipPAC Pte. Ltd., ChipMOS Technologies Inc., Jiangsu Changjiang Electronics Technology Co., Ltd., Intel Corporation, Samsung Electronics Co., Ltd., Fujitsu Limited, Texas Instruments Incorporated, Infineon Technologies AG, Toshiba Corporation, STMicroelectronics N.V., Broadcom Inc., Microchip Technology Inc., NXP Semiconductors N.V., Qualcomm Technologies, Inc., Analog Devices, Inc.
Primary Target Market
- Market Players of System in Package (Sip) Technology
- Investors
- End-users
- Government Authorities
- Consulting And Research Firm
- Venture capitalists
- Third-party knowledge providers
- Value-Added Resellers (VARs)
Market Segment:
This study forecasts global, regional, and country revenue from 2019 to 2030. INFINITIVE DATA EXPERT has segmented the global System in Package (Sip) Technology market based on the below-mentioned segments:
Global System in Package (Sip) Technology Market, By Packaging Method
Wire Bond
Flip Chip
Fan-Out Wafer Leve
Global System in Package (Sip) Technology market, By Device
Power Management Integrated Circuit (PMIC)
Microelectromechanical Systems (MEMS)
RF Front-End, RF Power Amplifier
Application Processor
Baseband Processor
Global System in Package (Sip) Technology Market, By End User
Consumer Electronics
Automotive
Telecommunication
Industrial System
Aerospace and Defense
Automotive and Transportation
Healthcare
Global System in Package (Sip) Technology market, Regional Analysis
- Europe: Germany, Uk, France, Italy, Spain, Russia, Rest of Europe
- The Asia Pacific: China,Japan,India,South Korea,Australia,Rest of Asia Pacific
- South America: Brazil, Argentina, Rest of South America
- Middle East & Africa: UAE, Saudi Arabia, Qatar, South Africa, Rest of Middle East & Africa
About This Research
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