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The size of the global advanced packaging market was estimated at USD 26.39 billion in 2022 and is anticipated to increase to USD 56 billion by 2030, rising at a CAGR of 8.84% over the forecast period (2023-2030) from USD 30.69 billion.
In the last stage of the semiconductor manufacturing process, advanced packaging protects silicon wafers, logic components, and memory from physical damage and corrosion. A circuit board can be attached to the chip thanks to advanced packaging. Additionally, it entails the combining of a number of unique approaches, such as 2.5D, 3D-IC, fan-out wafer-level packaging, and system-in-package.
With the demand for smartphones, devices, and the Internet of Things (IoT) increasing along with the rapid growth of the advanced packaging market, specifically fan out wafer level packaging, advanced packaging suppliers are developing procedures and strategies to lower the overall cost of advanced packaging and provide maximum operational efficiency. Due to the high cost of its operation, advanced packaging is currently mostly employed for high-end products and applications pertaining to specialized markets, such as wafer and die manufacture. The differing packaging needs of different integrated circuits (ICs) present potential for advanced packaging to outpace standard packaging techniques. Additionally, advanced packaging is anticipated to have greater capabilities than conventional packaging options, which is anticipated to present profitable chances for market trends in advanced packaging in the upcoming years.
The COVID-19 epidemic has made it difficult for most chip makers to sustain test operations and source raw materials, which has reduced the revenue from the advanced packaging sector. Numerous fab facilities have been shut down as a result of the statewide lockdown that some governments imposed, and there is a scarcity of fab engineers and operators. Furthermore, because of the shrinking production capacity in the consumer electronics, automotive, and other industries, foundries and IDMs are seeing a decline in demand for advanced packaging.
With multiple major competitors striving for market supremacy, the global advanced packaging market is characterized by fierce competition and a dynamic landscape. Companies that operate in this industry make a constant effort to provide cutting-edge packaging solutions and maintain an advantage in the battle to fulfill changing customer needs. Prominent semiconductor packaging firms including Intel Corporation, Advanced Micro Devices (AMD), Taiwan Semiconductor Manufacturing Company (TSMC), and Samsung Electronics are major players in the global advanced packaging market. These behemoths are renowned for investing a lot of time and money in research and development in order to bring forward cutting-edge products and sophisticated packaging strategies that stimulate market expansion. Other players that significantly contribute to the competitive landscape of the market include ASE Group, Amkor Technology, JCET Group, and Powertech Technology. These businesses specialize in providing a wide range of packaging solutions that are adapted to the particular requirements of different sectors and applications.
Because it makes it possible to create thinner and more affordable packages, fan-out wafer-level packaging has become very popular and is frequently used in high-performance applications and mobile devices. As it enables the integration of many processors, various technologies, and passive components into a single package, improving system performance and decreasing form factor, system-in-package integration is growing in popularity.
Report Coverage
Global Advanced Packaging research report categorizes the market for global based on various segments and regions, forecasts revenue growth, and analyzes trends in each submarket. Global Advanced Packaging report analyses the key growth drivers, opportunities, and challenges influencing the global market. Recent market developments and Advanced Packaging competitive strategies such as expansion, product launch and development, partnership, merger, and acquisition have been included to draw the competitive landscape in the market. The report strategically identifies and profiles the key Advanced Packaging market players and analyses their core competencies in each global market sub-segments.
Key Points Covered in the Report
Competitive Environment:
The research provides an accurate study of the major organisations and companies operating in the global Advanced Packaging market, along with a comparative evaluation based on their product portfolios, corporate summaries, geographic reach, business plans, Advanced Packaging market shares in specific segments, and SWOT analyses. A detailed analysis of the firms' recent news and developments, such as product development, inventions, joint ventures, partnerships, mergers and acquisitions, strategic alliances, and other activities, is also included in the study. This makes it possible to assess the level of market competition as a whole.
List of Major Market Participants
AMKOR TECHNOLOGY, INTERNATIONAL BUSINESS MACHINES CORPORATION (IBM), INTEL CORPORATION, RENESAS ELECTRONICS, TOSHIBA CORPORATION, MICROCHIP TECHNOLOGY INC., ANALOG DEVICES, INC., TEXAS INSTRUMENTS, QUALCOMM TECHNOLOGIES, INC., TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED, Advanced Micro Devices (AMD) (United States), Samsung Electronics (South Korea), ASE Group (Taiwan), JCET Group (China), Powertech Technology (Taiwan), Siliconware Precision Industries Co., Ltd. (SPIL) (Taiwan), ChipMOS Technologies Inc. (Taiwan), UTAC Holdings Ltd. (Singapore), Tokyo Electron Limited (Japan), SCHOTT AG (Germany), Palomar Technologies (United States), Rudolph Technologies (United States), BESI Group (Netherlands), STATS ChipPAC Ltd. (Singapore)
Primary Target Market
Market Segment:
This study forecasts global, regional, and country revenue from 2019 to 2030. INFINITIVE DATA EXPERT has segmented the global Advanced Packaging market based on the below-mentioned segments:
Global Advanced Packaging Market, By Type
Flip Chip CSP
Flip-Chip Ball Grid Array
Wafer Level CSP
5D/3D
Fan Out WLP
Others
Global Advanced Packaging Market, By End User
Consumer Electronics
Automotive
Industrial
Healthcare
Aerospace & Defense
Others
Global Advanced Packaging market, Regional Analysis
In the last stage of the semiconductor manufacturing process, advanced packaging protects silicon wafers, logic components, and memory from physical damage and corrosion. A circuit board can be attached to the chip thanks to advanced packaging. Additionally, it entails the combining of a number of unique approaches, such as 2.5D, 3D-IC, fan-out wafer-level packaging, and system-in-package.
With the demand for smartphones, devices, and the Internet of Things (IoT) increasing along with the rapid growth of the advanced packaging market, specifically fan out wafer level packaging, advanced packaging suppliers are developing procedures and strategies to lower the overall cost of advanced packaging and provide maximum operational efficiency. Due to the high cost of its operation, advanced packaging is currently mostly employed for high-end products and applications pertaining to specialized markets, such as wafer and die manufacture. The differing packaging needs of different integrated circuits (ICs) present potential for advanced packaging to outpace standard packaging techniques. Additionally, advanced packaging is anticipated to have greater capabilities than conventional packaging options, which is anticipated to present profitable chances for market trends in advanced packaging in the upcoming years.
The COVID-19 epidemic has made it difficult for most chip makers to sustain test operations and source raw materials, which has reduced the revenue from the advanced packaging sector. Numerous fab facilities have been shut down as a result of the statewide lockdown that some governments imposed, and there is a scarcity of fab engineers and operators. Furthermore, because of the shrinking production capacity in the consumer electronics, automotive, and other industries, foundries and IDMs are seeing a decline in demand for advanced packaging.
With multiple major competitors striving for market supremacy, the global advanced packaging market is characterized by fierce competition and a dynamic landscape. Companies that operate in this industry make a constant effort to provide cutting-edge packaging solutions and maintain an advantage in the battle to fulfill changing customer needs. Prominent semiconductor packaging firms including Intel Corporation, Advanced Micro Devices (AMD), Taiwan Semiconductor Manufacturing Company (TSMC), and Samsung Electronics are major players in the global advanced packaging market. These behemoths are renowned for investing a lot of time and money in research and development in order to bring forward cutting-edge products and sophisticated packaging strategies that stimulate market expansion. Other players that significantly contribute to the competitive landscape of the market include ASE Group, Amkor Technology, JCET Group, and Powertech Technology. These businesses specialize in providing a wide range of packaging solutions that are adapted to the particular requirements of different sectors and applications.
Because it makes it possible to create thinner and more affordable packages, fan-out wafer-level packaging has become very popular and is frequently used in high-performance applications and mobile devices. As it enables the integration of many processors, various technologies, and passive components into a single package, improving system performance and decreasing form factor, system-in-package integration is growing in popularity.
Report Coverage
Global Advanced Packaging research report categorizes the market for global based on various segments and regions, forecasts revenue growth, and analyzes trends in each submarket. Global Advanced Packaging report analyses the key growth drivers, opportunities, and challenges influencing the global market. Recent market developments and Advanced Packaging competitive strategies such as expansion, product launch and development, partnership, merger, and acquisition have been included to draw the competitive landscape in the market. The report strategically identifies and profiles the key Advanced Packaging market players and analyses their core competencies in each global market sub-segments.
| REPORT ATTRIBUTES | DETAILS |
|---|---|
| Study Period | 2017-2030 |
| Base Year | 2022 |
| Forecast Period | 2022-2030 |
| Historical Period | 2017-2021 |
| Unit | Value (USD Billion) |
| Key Companies Profiled | AMKOR TECHNOLOGY, INTERNATIONAL BUSINESS MACHINES CORPORATION (IBM), INTEL CORPORATION, RENESAS ELECTRONICS, TOSHIBA CORPORATION, MICROCHIP TECHNOLOGY INC., ANALOG DEVICES, INC., TEXAS INSTRUMENTS, QUALCOMM TECHNOLOGIES, INC., TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED, Advanced Micro Devices (AMD) (United States), Samsung Electronics (South Korea), ASE Group (Taiwan), JCET Group (China), Powertech Technology (Taiwan), Siliconware Precision Industries Co., Ltd. (SPIL) (Taiwan), ChipMOS Technologies Inc. (Taiwan), UTAC Holdings Ltd. (Singapore), Tokyo Electron Limited (Japan), SCHOTT AG (Germany), Palomar Technologies (United States), Rudolph Technologies (United States), BESI Group (Netherlands), STATS ChipPAC Ltd. (Singapore) |
| Segments Covered | • By Product |
| Customization Scope | Free report customization (equivalent to up to 3 analyst working days) with purchase. Addition or alteration to country, regional & segment scope |
Key Points Covered in the Report
- Market Revenue of Advanced Packaging Market from 2021 to 2030.
- Market Forecast for Advanced Packaging Market from 2021 to 2030.
- Regional Market Share and Revenue from 2021 to 2030.
- Country Market share within region from 2021 to 2030.
- Key Type and Application Revenue and forecast.
- Company Market Share Analysis, Advanced Packaging competitive scenario, ranking, and detailed company
profiles. - Market driver, restraints, and detailed COVID-19 impact on Advanced Packaging
Market
Competitive Environment:
The research provides an accurate study of the major organisations and companies operating in the global Advanced Packaging market, along with a comparative evaluation based on their product portfolios, corporate summaries, geographic reach, business plans, Advanced Packaging market shares in specific segments, and SWOT analyses. A detailed analysis of the firms' recent news and developments, such as product development, inventions, joint ventures, partnerships, mergers and acquisitions, strategic alliances, and other activities, is also included in the study. This makes it possible to assess the level of market competition as a whole.
List of Major Market Participants
AMKOR TECHNOLOGY, INTERNATIONAL BUSINESS MACHINES CORPORATION (IBM), INTEL CORPORATION, RENESAS ELECTRONICS, TOSHIBA CORPORATION, MICROCHIP TECHNOLOGY INC., ANALOG DEVICES, INC., TEXAS INSTRUMENTS, QUALCOMM TECHNOLOGIES, INC., TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED, Advanced Micro Devices (AMD) (United States), Samsung Electronics (South Korea), ASE Group (Taiwan), JCET Group (China), Powertech Technology (Taiwan), Siliconware Precision Industries Co., Ltd. (SPIL) (Taiwan), ChipMOS Technologies Inc. (Taiwan), UTAC Holdings Ltd. (Singapore), Tokyo Electron Limited (Japan), SCHOTT AG (Germany), Palomar Technologies (United States), Rudolph Technologies (United States), BESI Group (Netherlands), STATS ChipPAC Ltd. (Singapore)
Primary Target Market
- Market Players of Advanced Packaging
- Investors
- End-users
- Government Authorities
- Consulting And Research Firm
- Venture capitalists
- Third-party knowledge providers
- Value-Added Resellers (VARs)
Market Segment:
This study forecasts global, regional, and country revenue from 2019 to 2030. INFINITIVE DATA EXPERT has segmented the global Advanced Packaging market based on the below-mentioned segments:
Global Advanced Packaging Market, By Type
Flip Chip CSP
Flip-Chip Ball Grid Array
Wafer Level CSP
5D/3D
Fan Out WLP
Others
Global Advanced Packaging Market, By End User
Consumer Electronics
Automotive
Industrial
Healthcare
Aerospace & Defense
Others
Global Advanced Packaging market, Regional Analysis
- Europe: Germany, Uk, France, Italy, Spain, Russia, Rest of Europe
- The Asia Pacific: China,Japan,India,South Korea,Australia,Rest of Asia Pacific
- South America: Brazil, Argentina, Rest of South America
- Middle East & Africa: UAE, Saudi Arabia, Qatar, South Africa, Rest of Middle East & Africa
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